SINGLESIDED     DOUBLESIDED     MULTILAYER
SINGLESIDED
Material:	FR4
	CEM3
	Polyimide, Polyester
Final Thickness:	0.10 mm – 6.50 mm
Final Cu:	18 um – 210 um
Max. Panelsize:	max. 584 mm x 635 mm
Contour:	scoring, routing, punching
Surface:	HAL HAL lead free
	OSP (Entek, Glicoat)
	Chemical NI/AU
	Chemical SN
	Chemical AG
	Galvanic NI/AU (0,8-1,0 um)
Soldermask:	Taiyo, Tamura, Probimer, Lackwerke Peters
Additional Inks:	Silkscreen
	Peelable Mask
	Carbon Ink
Tracks / Spacing:	min. 150 um
Enddiameter:	min. 0.30 mm
Final Inspection:	visual, E-Test
DOUBLESIDED
Material:	FR4
	FR4 HighTG 170°
	Aluminiumsubstrate
Final Thickness:	0.10 mm – 6.50 mm
Final Cu:	35 um – 245 um
Max. Panelsize:	max. 584 mm x 635 mm
Contour:	scoring, routing, punching
Surface:	HAL HAL lead free
	OSP (Entek, Glicoat)
	Chemical NI/AU
	Chemical Sn
	Chemical AG
	Galvanic NI/AU (0,8-1,0 um)
Soldermask:	Taiyo, Tamura, Probimer, Lackwerke Peters
Additional Inks:	Silkscreen
	Peelable Mask
	Carbon Ink
Tracks / Spacing:	min. 100 um
Enddiameter:	min. 0.30 mm
Final Inspection:	visual, E-Test
MULTILAYER
Material:	FR4
	FR4 HighTG 170°
	BT
	Teflon
	Rogers
	Getek
Final Thickness:	0.50 mm – 4.80 mm
Final Cu:	35 um – 245 um
Qty of Layers:	4 - 26 Layer
Max. Panelsize:	max. 584 mm x 635 mm
Contour:	scoring, routing, punching
Surface:	HAL HAL lead free
	OSP (Entek, Glicoat)
	Chemical NI/AU
	Chemical SN
	Chemical AG
	Galvanic NI/AU (0,8-1,0 um)
Soldermask:	Taiyo, Tamura, Probimer, Lackwerke Peters
Additional Inks:	Silkscreen
	Peelable Mask
	Carbon Ink
Tracks / Spacing:	min. 80 um
Enddiameter:	min. 0.15 mm
Specials:	Impedance Control
	HDI-Technology
	Blind and Burried Vias
Final Inspection:	E-Test