Capability
| Technical Datas | |
| Max. Panelsize: | 584,2 mm x 635,0 mm |
| Final Thickness: | 0,1 – 6,5 mm |
| Smallest holesize: | 0,15 mm |
| Smallest tracks / spaces | 80 µm |
| Max. Final Cu: | Outer Layer 245 µm Inner Layer 210 µm |
| Qty. of Layers (rigid): | 1-26 |
| Qty of Layers (flexible): | 1-8 |
| Blind / Buried Vias: | HDI / Laser |
| Impedance Control: | possible |
| Electrical Test | |
| Press-fit technology |
Basematerial
FR-4; CEM-1, CEM-3
BT
High TG (150-180°) Isola and Shengyi
Teflon
Rogers
Getek
Halogen-free
Polyester, Polyimidi (FLEX)
Alu-Substrate
| Surface | Solderability |
| HAL | 12 months |
| HAL lead free | 12 months |
| (OSP) ENTEK, Glicoat | 6 months |
| Chem. Ni/Au | 12 months |
| Chem. SN | 6 months |
| Chem. AG | 6 months |
| Galvanic NI/AU (0,8-1,0 um) | |
| Carbon Ink | |
| Peelable Mask (Bluemask) | |
| Viaplugging |
Soldermask
TAIYO, TAMURA, PROBIMER, Lackwerke Peters
Colours : green, blue, red, black, yellow, white
Silkscreen
Min. 100 µm
Colours: white, yellow, black
All tolerances are confirm to the IPC-and PERFAG-Norm.
All of our partners are ISO-certified and UL-listed.
Please contacts us in case of other extraordinarty specifications.